Electrical Engineering, Columbia University, New York, NY
Despite the great excitements that 2D materials have brought in the past decade, there still are various practical limitations to overcome, while more commercially viable applications need to be identified. Among such two-dimensional (2D) materials, graphene, the first 2D material discovered, has received the most attention in science/engineering communities owing to its unique physics as well as high commercial potentials. This talk will discuss a few different approaches to utilize graphene for commercial applications. In detail, 1) reinforced composite for medical application, 2) graphene metallization, 3) force sensing, 4) incandescent light emission, and 5) RF signal processing will be discussed. Finally, ongoing efforts on integrating graphene nano-electro-mechanical systems (GNEMS) with conventional CMOS technology, where the benefits of mature CMOS and emerging GNEMS can complement one another, will be presented.
Sunwoo Lee is currently pursuing his Ph.D. in Electrical Engineering at the Columbia University. His primarily interest lies in developing electro-mechanical systems based on atomically thin materials such as graphene for signal processing. He received his B.S. degree in Electrical and Computer Engineering from Cornell University (2010) and a M.S. in Electrical Engineering (2012) from Columbia University. In addition, he worked on high quality CVD graphene for spintronics applications at Spintronics and Photovoltaic Division in IBM T.J. Watson Research Center, Yorktown Heights, NY in the summer of 2013, and also worked on design and evaluation of next generation MEMS gyroscopes at Product Engineering Division in Analog Devices, Inc., Wilmington, MA in the summer of 2014. He is a two-time winner of the Qualcomm Innovation Fellowship (QInF) – for ‘CMOS Compatible Graphene Nanoelectromechanical Systems for Next Generation RF Design’ in 2012 and ‘Graphene Resonator Based Mixer-First Receiver on CMOS for Digitally Controlled and Widely Tunable RF Interface’ in 2013.