Anjan Mukherjee(1), Dong-chul kim(1,2), Hoyeol Yun(3), Miri Seo(4), Jung Tae Nam(5), Keun Soo Kim(5), Sang Wook Lee(4), A. Mazid Munshi(2), Dasa L. Dheeraj(2), Bjørn-Ove Fimland(1,2), Helge Weman(1,2) (1) Department of Electronic Systems, Norwegian University of Science and Technology, NO-7491, Trondheim, Norway (2) Crayonano As, Otto Nielsens vei 12, NO-7052, Trondheim, Norway (3) School of Physics, Konkuk University, 143 071, Seoul, Republic of Korea (4) Department of Physics, Ewha Womans University,120 750, Seoul, Republic of Korea (5) Department of physics and Graphene Research Institute, Sejong University, 143 747, Seoul, Republic of Korea In this report, we present the fabrication process of single GaAs NW/graphene hybrid devices with a planar junction configuration. A position-controlled micro transfer and imprinting technique that enables us to choose a single NW (or graphene) selectively on a target graphene (or a single NW) for high quality junction has been developed. Both GaAs NW/graphene bottom-and top-contact devices will be presented. For the fabrication of the first approch, we utilized the weak nature of adhesion between a polymer resist and a hydrophobic surface. For graphene/single NW top- contact devices, a key issue is how to make single NW embedded in a flat-surfaced structure, which is critical for the successful transfer of graphene on top of the NWs. Using a curable photo- resist layer, single NW could be transferred and imprinted for the embedded NW structure. [1] Xiaoqiang Li et al., Nano Energy, 16(2015) 310-319 [2] Sander A. Mann et al., Nature Nanotechnology, 11(2016) 1071-1075 [3] FuX. W. et al., Appl. Phys. Lett, 100(2012) 223114 ![]() |